Sputtering System

Sputter deposition is a technique used to deposit thin films by sputtering a block of source material “target”, onto a surface “substrate”.
	Sputtered atoms ejected into the gas phase are not in their thermodynamic equilibrium state, and tend to deposit on all surfaces in the vacuum chamber. A glass substrate placed in the chamber will be coated with a thin film. Sputtering uses argon plasma.
The CD/DVD mastering ATC-B-2436 handles one rotating substrate at a time and employs a single rotating magnetron for optimum uniformity.
	•180mm substrate holder •low maintenance •side sputtering for extended process time •Easy to use